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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials)

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Attributes

Release Date

Nov 22, 2019

Authors

Zhang, Hengyun, Che, Faxing, LIn, Tingyu, Zhao, Wensheng

Edition

1

Genre

TECHNOLOGY & ENGINEERING

Label

Woodhead Publishing

Content Languages

[object Object], [object Object], [object Object]

Number Of Items

1

Number Of Pages

434

Publication Date

2019-11-29

Publisher

Woodhead Publishing

Studio

Woodhead Publishing

Lang

en-US

Adult Product

No

Product Identifiers

AID

AID50OV16001

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